| 000 | 01106cam a22003014a 4500 | ||
|---|---|---|---|
| 005 | 20250930120642.0 | ||
| 008 | 050525s2005 xxua b 001 0 eng | ||
| 020 |
_a041531190X (alk. paper) _cRM647.70 |
||
| 039 | 9 |
_a200507221509 _bhamudah _c200507221026 _dhamka _c200507061358 _dariff _c200505252102 _didah _y05-25-2005 _zidah |
|
| 090 | _aTK7870.15.M536 3 | ||
| 090 | _aTK7870.15 | ||
| 245 | 0 | 0 |
_aMicroelectronic packaging / _cedited by M. Datta, T. Osaka, J. W. Schultze. |
| 260 |
_aBoca Raton, FL : _bCRC Press, _c2005. |
||
| 300 |
_a542 p. : _bill. ; _c25 cm. |
||
| 440 | 0 |
_aNew trends in electrochemical technology ; _vv. 3 |
|
| 504 | _aIncludes bibliographical references and index. | ||
| 650 | 0 |
_aMicroelectronic packaging. _960415 |
|
| 700 | 1 | _aDatta, Madhav. | |
| 700 | 1 |
_aOsaka, Tetsuya, _d1945- |
|
| 700 | 1 |
_aSchultze, J. W. _q(Joachim Walter) |
|
| 907 |
_a.b13533654 _b2020-10-15 _c2019-11-12 |
||
| 942 |
_c01 _n0 _kTK7870.15.M536 3 |
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| 914 | _avtls003305898 | ||
| 990 | _amaa | ||
| 991 | _aJabatan Seni Bina | ||
| 998 |
_al _b2005-12-05 _cm _da _feng _gxxu _y0 _z.b13533654 |
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| 999 |
_c352554 _d352554 |
||