| 000 | 01214cam a22003135a 4500 | ||
|---|---|---|---|
| 005 | 20250930120406.0 | ||
| 008 | 050304s2004 xxua b 000 0 eng | ||
| 020 |
_a3540221875 (alk. paper) _cRM 477.63 |
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| 039 | 9 |
_a200507221048 _bhamka _c200507061504 _dariff _c200503091438 _didah _y03-04-2005 _zidah |
|
| 090 | _aTK7874.S34 3 | ||
| 100 | 1 | _aSchwizer, Juerg. | |
| 245 | 1 | 0 |
_aForce sensors for microelectronic packaging applications / _cJ. Schwizer, M. Mayer, O. Brand. |
| 260 |
_aBerlin : _bSpringer-Verlag, _c2004. |
||
| 300 |
_aviii, 178 p. : _bill. ; _c24 cm. |
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| 440 | 0 | _aMicrotechnology and mems | |
| 504 | _aIncludes bibliographies and index | ||
| 650 | 0 |
_aMicroelectronic packaging. _960415 |
|
| 650 | 0 | _aWire bonding (Electronic packaging) | |
| 700 | 1 |
_aMayer, M. _q(Michael Andreas), _d1971- |
|
| 700 | 1 |
_aBrand, Oliver, _d1964- _955276 |
|
| 856 | 4 | 1 |
_3Table of contents _uhttp://www.loc.gov/catdir/toc/fy051/2004110615.html |
| 907 |
_a.b13488661 _b2019-11-12 _c2019-11-12 |
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| 942 |
_c01 _n0 _kTK7874.S34 3 |
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| 914 | _avtls003301098 | ||
| 990 | _amaa | ||
| 991 | _aInstitut Kejuruteraan Mikro dan Nanoelektronik | ||
| 998 |
_al _b2005-04-03 _cm _da _feng _gxxu _y0 _z.b13488661 |
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| 999 |
_c348084 _d348084 |
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