| 000 | 01056nam a2200301 a 4500 | ||
|---|---|---|---|
| 005 | 20250930092401.0 | ||
| 008 | 981208s1993 maua 000 0 eng | ||
| 010 | _a93-007685 | ||
| 020 | _a0750692677 | ||
| 039 | 9 |
_a200704181023 _bfati _y08-18-1999 _zload |
|
| 090 | _aTK7870.15.C52 | ||
| 090 |
_aTK7870.15 _b.C52 |
||
| 245 | 0 | 0 |
_aCharacterization of integrated circuit packaging materials / _ceditors, Thomas M. Moore and Robert G. McKenna ; managing editor, Lee E. Fitzpatrick |
| 260 |
_aBoston : _bButterworth-Heinemann, _c1993 |
||
| 300 |
_a274 p. : _bill. ; _c25 cm. |
||
| 440 | 0 | _aMaterials characterization series | |
| 650 | 0 |
_aElectronic packaging _xMaterials |
|
| 650 | 0 |
_aIntegrated circuits _xDesign and construction |
|
| 700 | 1 | _aMoore, Thomas M. | |
| 700 | 1 |
_aMcKenna, Robert G. _941256 |
|
| 907 |
_a.b10325256 _b2021-05-28 _c2019-11-12 |
||
| 942 |
_c01 _n0 _kTK7870.15.C52 |
||
| 914 | _avtls000033952 | ||
| 990 | _agab | ||
| 991 | _aFakulti Kejuruteraan | ||
| 998 |
_al _b1999-05-08 _cm _da _feng _gmau _y0 _z.b10325256 |
||
| 999 |
_c34512 _d34512 |
||