| 000 | 01114nam a2200301 a 4500 | ||
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| 005 | 20250930115848.0 | ||
| 007 | hd ufu baaa | ||
| 008 | 040721s2002 my a am 00 eng | ||
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_a200804202035 _bnordin _y07-21-2004 _znorsiah |
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| 040 | _aUKM | ||
| 090 | _amikrofilem tesis TK7874.T36 2004 | ||
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_amikrofilem tesis TK7874 _b.T36 2004 |
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| 100 | 1 | _aTan, Chee Wei | |
| 245 | 1 | 2 |
_aA study of wire bonded Cu-A1 in microelectronics packaging _h[microform] / _cTan Chee Wei |
| 260 |
_aBangi : _bPerpustakaan Tun Seri Lanang, _c2004 |
||
| 300 |
_a1 microfilm reel ; _c35 mm. |
||
| 502 | _aTesis (Sarjana Sains) - Universiti Kebangsaan Malaysia, 2002 | ||
| 610 | 2 | 0 |
_aUniversiti Kebangsaan Malaysia _xDissertations _962865 |
| 650 | 0 |
_aMicroelectronic packaging _960415 |
|
| 650 | 0 |
_aMicroeclectronic packaging _xTechnological innovations |
|
| 907 |
_a.b13407120 _b2022-05-23 _c2019-11-12 |
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| 942 |
_c3 _n0 _kmikrofilem tesis TK7874.T36 2004 |
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| 914 | _avtls003292489 | ||
| 990 | _asnm | ||
| 991 | _aKoleksi Arkib | ||
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_at _b2004-08-07 _cm _dy _feng _gmy _y0 _z.b13407120 |
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_c340010 _d340010 |
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