| 000 | 01217nam a22003134a 4500 | ||
|---|---|---|---|
| 005 | 20250930115412.0 | ||
| 008 | 040204s2001 xxua i 001 0 eng | ||
| 020 |
_a0071363270 _cRM401.80 |
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| 039 | 9 |
_a200403091442 _bnuri _c200403010907 _dhamzah _c200402040929 _dzarina _y02-04-2004 _zzarina |
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| 090 | _aTK7874.L31684 3 | ||
| 090 | _aTK7874 | ||
| 100 | 1 | _aLau, John H. | |
| 245 | 1 | 0 |
_aMicrovias : _bfor low-cost, high-density interconnects / _cJohn H. Lau, S.W. Ricky Lee |
| 260 |
_aNew York : _bMcGraw-Hill, _c2001 |
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| 300 |
_axxiii, 565 p. : _bill. ; _c24 cm. |
||
| 650 | 0 |
_aMicroelectronic packaging _960415 |
|
| 650 | 0 |
_aIntegrated circuits _xDesign and construction _xCost control |
|
| 650 | 0 |
_aSemiconductors _xJunctions |
|
| 650 | 0 | _aPrinted circuits | |
| 700 | 1 | _aLee, S. W. Ricky | |
| 856 | 4 | 1 |
_3Table of contents _uhttp://www.loc.gov/catdir/toc/mh031/2001030752.html |
| 856 | 4 | 2 |
_3Publisher description _uhttp://www.loc.gov/catdir/description/mh031/2001030752.html |
| 907 |
_a.b13326521 _b2020-10-15 _c2019-11-12 |
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| 942 |
_c01 _n0 _kTK7874.L31684 3 |
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| 914 | _avtls003284051 | ||
| 991 | _aPusat Pengajian Siswazah | ||
| 998 |
_al _b2004-04-02 _cm _da _feng _gxxu _y0 _z.b13326521 |
||
| 999 |
_c332058 _d332058 |
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