| 000 | 01078nam a2200265 a 4500 | ||
|---|---|---|---|
| 008 | 031223s2002 my a m 000 0 eng | ||
| 039 | 9 |
_a200404221206 _bbakar _c200404151406 _ddiana _c200403301108 _dnorehan _y12-23-2003 _znorehan |
|
| 090 | _aTK7874.T36 2002 tesis | ||
| 100 | 1 | _aTan, Chee Wei | |
| 245 | 1 | 2 |
_aA study of wire bonded Cu-A1 in microelectronics packaging / _cTan Chee Wei |
| 260 |
_aBangi : _bFakulti Sains dan Teknologi, Universiti Kebangsaan Malaysia, _c2002 |
||
| 300 |
_axiv, 123 p. : _bill. ; _c30 cm. |
||
| 502 | _aTesis (Sarjana Sains) - Universiti Kebangsaan Malaysia, 2002 | ||
| 504 | _aReferences : p. 105-119 | ||
| 610 | 2 | 0 |
_aUniversiti Kebangsaan Malaysia _xDissertations _962865 |
| 650 | 0 |
_aMicroelectronic packaging _960415 |
|
| 650 | 0 |
_aMicroeclectronic packaging _xTechnological innovations |
|
| 907 |
_a.b13308002 _b2020-09-28 _c2019-11-12 |
||
| 942 |
_c3 _n0 _kTK7874.T36 2002 tesis |
||
| 914 | _avtls000345595 | ||
| 990 | _anmk | ||
| 990 | _aSbs/ndr | ||
| 991 | _aKoleksi Arkib | ||
| 998 |
_at _b2003-10-12 _cm _dx _feng _gmy _y0 _z.b13308002 |
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| 999 |
_c330238 _d330238 |
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