| 000 | 01166cam a2200313 a 4500 | ||
|---|---|---|---|
| 005 | 20250930114337.0 | ||
| 008 | 021115s1996 xxua b 001 0 eng | ||
| 010 | _a95-044649 | ||
| 020 |
_a0070366098 _cRM357.78 |
||
| 039 | 9 |
_a200211181101 _bfarid _c200211150917 _dsanusi _c200211150914 _dsanusi _y11-15-2002 _zsanusi |
|
| 090 | _aTK7874.F584 | ||
| 090 | _aTK7874 | ||
| 245 | 0 | 0 |
_aFlip chip technologies / _cJohn H. Lau, editor |
| 260 |
_aBoston, Mass. : _bMcGraw-Hill, _c1996 |
||
| 300 |
_axxiv, 565 p. : _bill. ; _c24 cm. |
||
| 440 | 0 | _aElectronic packaging and interconnection series | |
| 504 | _aIncludes bibliographical references and index | ||
| 650 | 0 |
_aMicroelectronic packaging _960415 |
|
| 650 | 0 |
_aMultichip modules (Microelectronics) _xDesign and construction |
|
| 700 | 1 | _aLau, John H. | |
| 856 | 4 | 1 |
_3Table of contents _uhttp://www.loc.gov/catdir/toc/mh022/95044649.html |
| 907 |
_a.b13141089 _b2021-05-28 _c2019-11-12 |
||
| 942 |
_c01 _n0 _kTK7874.F584 |
||
| 914 | _avtls000327297 | ||
| 990 | _afa | ||
| 991 | _aJabatan Kejuruteraan Elektrik, Elektronik & Sistem | ||
| 998 |
_al _b2002-02-11 _cm _da _feng _gxxu _y0 _z.b13141089 |
||
| 999 |
_c313733 _d313733 |
||