000			01552pam a2200361 a 4500
005			20250914124559.0
008			021001s1997 xxua b 001 0 eng
020			_a0070326193 _cRM261.30
039		9	_a201910311114 _bhayat _c200304091337 _dnuri _c200303311055 _dfarid _c200211081505 _dsanusi _y10-01-2002 _zsanusi
090			_aTK7836.H373 1997
090			_aTK7836 _b.H373 1997
100	1		_aHarman, George G.
245	1	0	_aWire bonding in microelectronics : _bmaterials, processes, reliability, and yield / _cGeorge G. Harmon.
250			_a2nd ed.
260			_aNew York : _bMcGraw-Hill, _c1997.
300			_axiv, 290 p. : _bill. ; _c24 cm.
440		0	_aElectronic packaging and interconnection series
500			_aRev. ed. of: Reliability and yield problems of wire bonding in microelectronics. 1989.
504			_aIncludes bibliographical references and index.
650		0	_aWire bonding (Electronic packaging) _xProduction control
650		0	_aElectronic packaging _xReliability.
650		0	_aElectronic packaging _xDefects.
650		0	_aSemiconductors _xFailure.
700	1		_aHarman, George G. _tReliability and yield problems of wire bonding in microelectronics.
856	4	1	_3Table of contents _uhttp://www.loc.gov/catdir/toc/mh022/97019652.html
907			_a.b13109418 _b2021-05-28 _c2019-11-12
942			_c01 _n0 _kTK7836.H373 1997
914			_avtls000323786
990			_afa
991			_aJabatan Kejuruteraan Elektrik, Elektronik & Sistem
998			_al _b2002-01-10 _cm _da _feng _gxxu _y0 _z.b13109418
999			_c310612 _d310612