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| 005 | 20250930113858.0 | ||
| 008 | 020717s2002 xxka 001 0 eng | ||
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_a0852960395 _cRM287.63 |
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_a200301031453 _bnuri _c200212101016 _dlaili _y07-17-2002 _zsanusi |
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| 090 | _aTK7871.85.S54 | ||
| 090 | _aTK7871.85 | ||
| 245 | 0 | 0 |
_aSilicon wafer bonding technology for VLSI and MEMS applications / _cedited by Subramanian S. Iyer and Andre J. Auberton-Herve |
| 260 |
_aLondon : _bINSPEC, _c2002 |
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| 300 |
_axxv, 149 p. : _bill. _c26 cm. |
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| 440 |
_aEMIS processing series ; _vno. 11 |
||
| 650 | 0 | _aSilicon-on-insulator technology | |
| 650 | 0 |
_aIntegrated circuits _xVery large scale integration |
|
| 650 | 0 | _aMicroelectromechanical systems | |
| 700 | 1 | _aIyer, Subramanian S. | |
| 700 | 1 | _aAuberton-Herve, Andre J. | |
| 710 | 2 |
_aInstitution of Electrical Engineers _938275 |
|
| 710 | 2 | _aElectronic Materials Information Service | |
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_a.b13055446 _b2021-05-28 _c2019-11-12 |
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_c01 _n0 _kTK7871.85.S54 |
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| 991 | _aKEJ -Pascasiswazah | ||
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