000 01100nam a2200325 a 4500
005 20250914102229.0
008 010920s2000 xxua b 000 0 eng
010 _a00-067430
020 _a0792372786
_cRM518.18
039 9 _a200111270954
_bbedah
_y09-20-2001
_zsanusi
090 _aTK7874.B46
090 _aTK7874
245 0 0 _aBenefiting from thermal and mechanical simulation in micro-electronics /
_cedited by G. Q. Zhang, L. J. Ernst, and O. de Saint Leger
260 _aBoston :
_bKluwer Academic Publishers,
_c2000
300 _ax, 192 p. :
_bill. ;
_c24 cm.
504 _aIncludes bibliographical references
650 0 _aMicroelectronics
_xDesign
650 0 _aMicroelectronics
_xsimulation methods
650 0 _aMicromechanics
700 1 _aZhang, G. Q.
700 1 _aErnst, L. J.
700 1 _aSaint Leger, O. de
907 _a.b12914253
_b2021-05-28
_c2019-11-12
942 _c01
_n0
_kTK7874.B46
914 _avtls000302940
990 _aza
991 _aJabatan Kejuruteraan Mekanik & Bahan
998 _al
_b2001-07-09
_cm
_da
_feng
_gxxu
_y0
_z.b12914253
999 _c291908
_d291908