| 000 | 00924nam a2200313 a 4500 | ||
|---|---|---|---|
| 005 | 20250930110233.0 | ||
| 008 | 981208s1993 xxu 00 eng | ||
| 010 | _a92-43285 | ||
| 020 | _a0442010583 | ||
| 035 | _a782978 | ||
| 039 | 9 |
_y08-18-1999 _zload |
|
| 090 | _aTK7870.15.T48 | ||
| 090 | _aTK7870.15 | ||
| 245 | 1 | 0 |
_aThermal stress and strain in microelectronics packaging _cedited by John H. Lau |
| 260 |
_aNew York _bVan Nostrand Reinhold _c1993 |
||
| 300 | _axxii, 883 p. : ill. ; 23 cm. | ||
| 590 | _a1 | ||
| 650 | _aElectronic packaging | ||
| 650 |
_amicroelectronic packaging _960415 |
||
| 650 | _aThermal stresses | ||
| 700 | 1 | _aLau, John H. | |
| 907 |
_a.b12341654 _b2021-05-28 _c2019-11-12 |
||
| 942 |
_c01 _n0 _kTK7870.15.T48 |
||
| 914 | _avtls000241520 | ||
| 991 | _aFakulti Kejuruteraan | ||
| 998 |
_al _b1999-05-08 _cm _da _feng _gxxu _y0 _z.b12341654 |
||
| 999 |
_c235484 _d235484 |
||