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	1.	Advances in 3D integrated circuits and systems / Hao Yu, Chuan-Seng Tan. by Yu, Hao (Electrical engineer) [author.] Tan, Chuan Seng [author.] Series: Series on emerging technologies in circuits and systems \| Series on emerging technologies in circuits and systemsPublisher: New Jersey : World Scientific, 2016Copyright date: ©2016 Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7874.893.Y83 3. Place hold
	2.	Design and modeling for 3D ICs and interposers / by Madhavan Swaminathan, Ki Jin Han. by Swaminathan, Madhavan [author.] Series: WSPC series in advanced integration and packaging ; 2Publisher: Hackensack, NJ : World Scientific, [2014]Copyright date: ©2014 Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7874.893.S836 3. Place hold

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