Solder Joint Technology  Materials, Properties, and Reliability /  [electronic resource] : 
edited by King-Ning Tu. 
 - New York :  Springer,  2007. 
 - 386 p. :  ill., digital ;  24 cm. 
 - Springer Series in Materials Science,  117  0933-033X ; .
<br/><br/><label>ISBN: </label>9780387388922 (electronic bk.) 9780387388908 (paper) 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Chemistry.<br/>Electronics and Microelectronics, Instrumentation.<br/>Manufacturing, Machines, Tools.<br/>Metallic Materials.<br/>Optical and Electronic Materials.<br/>Quality Control, Reliability, Safety and Risk.
<br/><br/><label>Dewey Class. No.: </label>621.381