An investigation on mechanical properties of tin-silver copper and tin-silver lead-free solder sphere used in FCPBGA electronic packages - Wong, Tszu Ling (2012)
Thesis (M.Sc.) - Universiti Kebangsaan Malaysia, 2012.
References : pages [76]-79.
Keywords: Universiti Kebangsaan Malaysia -- Dissertations; Dissertations, Academic -- Malaysia; Flip chip technology; Copper; Electronic packaging