Wong, Tszu Ling, <br/><br/>
An investigation on mechanical properties of tin-silver copper and tin-silver lead-free solder sphere used in FCPBGA electronic packages / 
Wong Tzu Ling. 
 - xiv, 85 pages :  some colour illustrations ;  30 cm. 
<br/><br/>Thesis (M.Sc.) - Universiti Kebangsaan Malaysia, 2012. 
<br/><br/>References : pages [76]-79. 
<br/><br/><label>Subjects--Corporate Names: </label><br/>Universiti Kebangsaan Malaysia--Dissertations.
<br/><br/><label>Subjects--Topical Terms: </label><br/>Dissertations, Academic--Malaysia.<br/>Flip chip technology.<br/>Copper.<br/>Electronic packaging.