Kesan kombinasi arus elektrik dan daya lekatan bagi proses lekatan wayar termosonik pakej dai bertingkat 3D quad flat nolead (QFN) - Saidatul Azura Radzi (Bangi: Perpustakaan Tun Seri Lanang, 2013)
Tesis (M.Sc.) - Universiti Kebangsaan Malaysia, 2011.
Rujukan : p. [89]-93.
Keywords: Universiti Kebangsaan Malaysia -- Dissertations; Electric currents; Metal bonding; Wire bonding (Electronic packaging).; Dissertations, Academic -- Malaysia