Saidatul Azura Radzi. <br/><br/>
Kesan kombinasi arus elektrik dan daya lekatan bagi proses lekatan wayar termosonik pakej dai bertingkat 3D quad flat nolead (QFN)  [microform] / 
Saidatul Azura binti Radzi. 
 - Bangi:  Perpustakaan Tun Seri Lanang,  2013 
 - xv, 96 p. :  ill. , photographs, samples ;  30 cm. 
<br/><br/>Tesis (M.Sc.) - Universiti Kebangsaan Malaysia, 2011. 
<br/><br/>Rujukan : p. [89]-93. 
<br/><br/><label>ISBN: </label> Hadiah 
<br/><br/><label>Subjects--Corporate Names: </label><br/>Universiti Kebangsaan Malaysia--Dissertations.
<br/><br/><label>Subjects--Topical Terms: </label><br/>Electric currents.<br/>Metal bonding.<br/>Wire bonding (Electronic packaging).<br/>Dissertations, Academic--Malaysia.