TY  - BOOK
AU  - Liu,S.
AU  - Liu,Yong
TI  - Modeling and simulation for microelectronic packaging assembly: manufacturing, reliability, and testing 
SN  - 9780470827802 (hbk.)
PY  - 2011///
CY  - [Beijing]
PB  - Chemical Industry Press
KW  - Microelectronic packaging
KW  - Simulation methods
N1  - Includes bibliographical references and index
N2  - 'This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation'--
ER  -