Liu, S.  1963- <br/><br/>
Modeling and simulation for microelectronic packaging assembly :  manufacturing, reliability, and testing / 
Sheng Liu, Yong Liu. 
 - [Beijing] :  Chemical Industry Press,  2011. 
 - xxii, 564 p. :  ill. ;  26 cm. 
<br/><br/>Includes bibliographical references and index. 
<br/><br/> 'This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation'-- 
<br/><br/><label>ISBN: </label>9780470827802 (hbk.) 0470827807 (hbk.) 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Microelectronic packaging--Simulation methods.