Solder joint reliability prediction for multiple environments - Perkins, Andrew E.; Sitaraman, Suresh K.; SpringerLink (Online service) (Boston, MA : Springer Science+Business Media, LLC, 2009)
Keywords: Electronic apparatus and appliances -- Reliability; Joints (Engineering) -- Reliability; Solder and soldering; Electronics and Microelectronics, Instrumentation; Metallic Materials; Optical and Electronic Materials; Quality Control, Reliability, Safety and Risk