Perkins, Andrew E. <br/><br/>
Solder joint reliability prediction for multiple environments  [electronic resource] / 
by Andrew E. Perkins, Suresh K. Sitaraman. 
 - Boston, MA :  Springer Science+Business Media, LLC,  2009. 
 - xv, 192 pages :  illustrations, digital. 
<br/><br/><label>ISBN: </label>9780387793948 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Electronic apparatus and appliances--Reliability.<br/>Joints (Engineering)--Reliability.<br/>Solder and soldering.<br/>Electronics and Microelectronics, Instrumentation.<br/>Metallic Materials.<br/>Optical and Electronic Materials.<br/>Quality Control, Reliability, Safety and Risk.