TY  - BOOK
AU  - Mohamad Firdaus Rosle
TI  - Pengoptimuman keadaan perlekatan dai dan perlekatan bebola termosonik terhadap prestasi pakej dai bertingkat 3D QFN
PY  - 2010///
KW  - Universiti Kebangsaan Malaysia
KW  - Dissertations
KW  - Wire bonding (Electronic packaging)
KW  - Electronic packaging
KW  - Dissertations, Academic
KW  - Malaysia
N1  - Tesis (Sarjana Sains) - Universiti Kebangsaan Malaysia, 2010; Rujukan : p. [113]-121
ER  -