Pengoptimuman keadaan perlekatan dai dan perlekatan bebola termosonik terhadap prestasi pakej dai bertingkat 3D QFN - Mohamad Firdaus Rosle (2010)
Tesis (Sarjana Sains) - Universiti Kebangsaan Malaysia, 2010
Rujukan : p. [113]-121
Keywords: Universiti Kebangsaan Malaysia -- Dissertations; Wire bonding (Electronic packaging); Electronic packaging; Dissertations, Academic -- Malaysia