RF and Microwave Microelectronics Packaging  [electronic resource] / 
edited by Ken Kuang, Franklin Kim, Sean S. Cahill. 
 - Boston, MA :  Springer Science+Business Media, LLC,  2010. 
 - xiv, 284 p. :  ill., digital. 
<br/><br/><label>ISBN: </label>9781441909848 (electronic bk.) 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Microelectronic packaging.<br/>Circuits and Systems<br/>Microwaves, RF and Optical Engineering<br/>Electronics and Microelectronics, Instrumentation<br/>Engineering
<br/><br/><label>Dewey Class. No.: </label>621.381046