TY  - BOOK
AU  - Kuang,Ken
AU  - Kim,Franklin
AU  - Cahill,Sean S.
TI  - RF and microwave microelectronics packaging
SN  - 9781441909831
PY  - 2009///
CY  - Heidelberg
PB  - Springer
KW  - Multichip modules (Microelectronics)
KW  - Microelectronic packaging
ER  -