RF and microwave microelectronics packaging / 
Ken Kuang, Franklin Kim, Sean S. Cahill, editors 
 - Heidelberg :  Springer,  2009 
 - xvi, 285 p. :  ill. ;  24 cm. 
<br/><br/><label>ISBN: </label>9781441909831  RM378.71 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Multichip modules (Microelectronics)<br/>Microelectronic packaging