Wafer level 3-d ics process technology - Tan, Chuan Seng.; Reif, L. Rafael; Gutmann, Ronald J.; SpringerLink (Online service) (Boston, MA : Springer-Verlag US, 2008)
Keywords: Integrated circuits -- Wafer-scale integration; Engineering; Surfaces and Interfaces, Thin Films; Optical and Electronic Materials; Electronics and Microelectronics, Instrumentation; Engineering, general