TY  - BOOK
AU  - Tummala,Rao R.
AU  - Swaminathan,Madhavan
TI  - Introduction to system-on-package (SOP): miniaturization of the entire system 
SN  - 0071459065 (hbk.)
PY  - 2008///
CY  - New York
PB  - McGraw-Hill
KW  - Multichip modules (Microelectronics)
KW  - Design and construction
KW  - Microelectronic packaging
N1  - Includes bibliographical references and index
ER  -