TY  - BOOK
AU  - Schwizer,Jurg
AU  - Mayer,Michael
AU  - Brand,Oliver
ED  - SpringerLink (Online service)
TI  - Force Sensors for Microelectronic Packaging Applications
SN  - 9783540269458 (electronic bk.)
AV  - TK7870.15 .S39 2005
U1  - 621.381046 22
PY  - 2005///
CY  - Berlin, Heidelberg
PB  - Springer-Verlag Berlin Heidelberg
KW  - Microelectronic packaging
KW  - Wire bonding (Electronic packaging)
KW  - Chemistry
KW  - Optical and Electronic Materials
KW  - Nanotechnology
KW  - Electronics and Microelectronics, Instrumentation
KW  - Physics and Applied Physics in Engineering
KW  - Quality Control, Reliability, Safety and Risk
UR  - https://eresourcesptsl.ukm.remotexs.co/login?url=http://dx.doi.org/10.1007/b138345
ER  -