Force Sensors for Microelectronic Packaging Applications - Schwizer, Jurg.; Mayer, Michael; Brand, Oliver; SpringerLink (Online service) (Berlin, Heidelberg : Springer-Verlag Berlin Heidelberg, 2005)
Keywords: Microelectronic packaging; Wire bonding (Electronic packaging); Chemistry; Optical and Electronic Materials; Nanotechnology; Electronics and Microelectronics, Instrumentation; Physics and Applied Physics in Engineering; Quality Control, Reliability, Safety and Risk