Schwizer, Jurg. <br/><br/>
Force Sensors for Microelectronic Packaging Applications  [electronic resource] / 
by Jurg Schwizer, Michael Mayer, Oliver Brand. 
 - Berlin, Heidelberg :  Springer-Verlag Berlin Heidelberg,  2005. 
 - viii, 178 p. :  ill., digital ;  24 cm 
 - Microtechnology and MEMS,  1615-8326 .
<br/><br/><label>ISBN: </label>9783540269458 (electronic bk.) 9783540221876 (paper) 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Microelectronic packaging.<br/>Wire bonding (Electronic packaging)<br/>Chemistry.<br/>Optical and Electronic Materials.<br/>Nanotechnology.<br/>Electronics and Microelectronics, Instrumentation.<br/>Physics and Applied Physics in Engineering.<br/>Quality Control, Reliability, Safety and Risk.
<br/><br/><label>LC Class. No.: </label>TK7870.15  / .S39 2005 
<br/><br/><label>Dewey Class. No.: </label>621.381046