TY  - BOOK
AU  - Cohn,Charles
AU  - Harper,Charles A.
TI  - Failure-free integrated circuit packages: systematic elimination of failures through reliability engineering, failure analysis, and material improvements 
PY  - 2005///
CY  - New York
PB  - McGraw-Hill
KW  - Microelectronic packaging
KW  - Integrated circuits
KW  - Fault tolerance
N1  - Includes bibliographical references and index
UR  - http://www.loc.gov/catdir/bios/mh051/2004533584.html
UR  - http://www.loc.gov/catdir/toc/mh051/2004533584.html
ER  -