TY  - BOOK
AU  - Schwizer,Juerg
AU  - Mayer,M.
AU  - Brand,Oliver
TI  - Force sensors for microelectronic packaging applications
SN  - 3540221875 (alk. paper)
PY  - 2004///
CY  - Berlin
PB  - Springer-Verlag
KW  - Microelectronic packaging
KW  - Wire bonding (Electronic packaging)
N1  - Includes bibliographies and index
UR  - http://www.loc.gov/catdir/toc/fy051/2004110615.html
ER  -