Schwizer, Juerg. <br/><br/>
Force sensors for microelectronic packaging applications / 
J. Schwizer, M. Mayer, O. Brand. 
 - Berlin :  Springer-Verlag,  2004. 
 - viii, 178 p. :  ill. ;  24 cm. 
 - Microtechnology and mems .
<br/><br/>Includes bibliographies and index 
<br/><br/><label>ISBN: </label>3540221875 (alk. paper)  RM 477.63 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Microelectronic packaging.<br/>Wire bonding (Electronic packaging)