TY  - BOOK
AU  - Moore,Thomas M.
AU  - McKenna,Robert G.
TI  - Characterization of integrated circuit packaging materials
SN  - 0750692677
PY  - 1993///
CY  - Boston
PB  - Butterworth-Heinemann
KW  - Electronic packaging
KW  - Materials
KW  - Integrated circuits
KW  - Design and construction
ER  -