Characterization of integrated circuit packaging materials / 
editors, Thomas M. Moore and Robert G. McKenna ; managing editor, Lee E. Fitzpatrick 
 - Boston :  Butterworth-Heinemann,  1993 
 - 274 p. :  ill. ;  25 cm. 
 - Materials characterization series .
<br/><br/><label>ISBN: </label>0750692677 
<br/><br/><label>LCCN: </label>93-007685 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Electronic packaging--Materials<br/>Integrated circuits--Design and construction