Tan, Chee Wei <br/><br/>
A study of wire bonded Cu-A1 in microelectronics packaging  [microform] / 
Tan Chee Wei 
 - Bangi :  Perpustakaan Tun Seri Lanang,  2004 
 - 1 microfilm reel ;  35 mm. 
<br/><br/>Tesis (Sarjana Sains) - Universiti Kebangsaan Malaysia, 2002 
<br/><br/><label>Subjects--Corporate Names: </label><br/>Universiti Kebangsaan Malaysia--Dissertations
<br/><br/><label>Subjects--Topical Terms: </label><br/>Microelectronic packaging<br/>Microeclectronic packaging--Technological innovations