TY  - BOOK
AU  - Tan,Chee Wei
TI  - A study of wire bonded Cu-A1 in microelectronics packaging
PY  - 2002///
CY  - Bangi
PB  - Fakulti Sains dan Teknologi, Universiti Kebangsaan Malaysia
KW  - Universiti Kebangsaan Malaysia
KW  - Dissertations
KW  - Microelectronic packaging
KW  - Microeclectronic packaging
KW  - Technological innovations
N1  - Tesis (Sarjana Sains) - Universiti Kebangsaan Malaysia, 2002; References : p. 105-119
ER  -