A study of wire bonded Cu-A1 in microelectronics packaging - Tan, Chee Wei (Bangi : Fakulti Sains dan Teknologi, Universiti Kebangsaan Malaysia, 2002)
Tesis (Sarjana Sains) - Universiti Kebangsaan Malaysia, 2002
References : p. 105-119
Keywords: Universiti Kebangsaan Malaysia -- Dissertations; Microelectronic packaging; Microeclectronic packaging -- Technological innovations