Tan, Chee Wei <br/><br/>
A study of wire bonded Cu-A1 in microelectronics packaging / 
Tan Chee Wei 
 - Bangi :  Fakulti Sains dan Teknologi, Universiti Kebangsaan Malaysia,  2002 
 - xiv, 123 p. :  ill. ;  30 cm. 
<br/><br/>Tesis (Sarjana Sains) - Universiti Kebangsaan Malaysia, 2002 
<br/><br/>References : p. 105-119 
<br/><br/><label>Subjects--Corporate Names: </label><br/>Universiti Kebangsaan Malaysia--Dissertations
<br/><br/><label>Subjects--Topical Terms: </label><br/>Microelectronic packaging<br/>Microeclectronic packaging--Technological innovations