TY  - BOOK
AU  - Lau,John H.
TI  - Flip chip technologies
SN  - 0070366098
PY  - 1996///
CY  - Boston, Mass.
PB  - McGraw-Hill
KW  - Microelectronic packaging
KW  - Multichip modules (Microelectronics)
KW  - Design and construction
N1  - Includes bibliographical references and index
UR  - http://www.loc.gov/catdir/toc/mh022/95044649.html
ER  -