Flip chip technologies / 
John H. Lau, editor 
 - Boston, Mass. :  McGraw-Hill,  1996 
 - xxiv, 565 p. :  ill. ;  24 cm. 
 - Electronic packaging and interconnection series .
<br/><br/>Includes bibliographical references and index 
<br/><br/><label>ISBN: </label>0070366098  RM357.78 
<br/><br/><label>LCCN: </label>95-044649 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Microelectronic packaging<br/>Multichip modules (Microelectronics)--Design and construction