Wire bonding in microelectronics : materials, processes, reliability, and yield - Harman, George G.; Harman, George G. (New York : McGraw-Hill, 1997)
Rev. ed. of: Reliability and yield problems of wire bonding in microelectronics. 1989.
Includes bibliographical references and index.
Keywords: Wire bonding (Electronic packaging) -- Production control; Electronic packaging -- Reliability; Electronic packaging -- Defects; Semiconductors -- Failure