Harman, George G. <br/><br/>
Wire bonding in microelectronics :  materials, processes, reliability, and yield / 
George G. Harmon. 
 - 2nd ed. 
 - New York :  McGraw-Hill,  1997. 
 - xiv, 290 p. :  ill. ;  24 cm. 
 - Electronic packaging and interconnection series .
<br/><br/> Rev. ed. of: Reliability and yield problems of wire bonding in microelectronics. 1989. 
<br/><br/>Includes bibliographical references and index. 
<br/><br/><label>ISBN: </label>0070326193  RM261.30 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Wire bonding (Electronic packaging)--Production control<br/>Electronic packaging--Reliability.<br/>Electronic packaging--Defects.<br/>Semiconductors--Failure.