TY  - BOOK
AU  - Zhang,G.Q.
AU  - Ernst,L.J.
AU  - Saint Leger,O.de
TI  - Benefiting from thermal and mechanical simulation in micro-electronics
SN  - 0792372786
PY  - 2000///
CY  - Boston
PB  - Kluwer Academic Publishers
KW  - Microelectronics
KW  - Design
KW  - simulation methods
KW  - Micromechanics
N1  - Includes bibliographical references
ER  -