TY  - BOOK
AU  - Lau,John H.
TI  - Thermal stress and strain in microelectronics packaging
SN  - 0442010583
PY  - 1993///
CY  - New York
PB  - Van Nostrand Reinhold
KW  - Electronic packaging
KW  - microelectronic packaging
KW  - Thermal stresses
ER  -