Thermal stress and strain in microelectronics packaging 
edited by John H. Lau 
 - New York  Van Nostrand Reinhold  1993 
 - xxii,  883 p. : ill. ; 23 cm. 
<br/><br/><label>ISBN: </label>0442010583 
<br/><br/><label>LCCN: </label>92-43285 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Electronic packaging<br/>microelectronic packaging<br/>Thermal stresses