TY  - BOOK
AU  - Mohd. Salleh Ismail.
TI  - Technology and application of aligned wafer bonding for three dimensional microstructures and microdevices
PY  - 1993///
CY  - Davis, Calif
PB  - University of California
KW  - Semiconductor wafers
KW  - Integrated circuits
KW  - Water
KW  - scale integration
N1  - Thesis (Doctor of Philosophy) - University of California, 1993
ER  -