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Electronic equipment packaging technology Gerald L. Ginsberg
Publication details: New York Van Nostrand Reinhold 1992Description: 279 p. : ill. ; 24 cmISBN:- 0442238185
| Item type | Current library | Home library | Call number | Materials specified | Copy number | Status | Date due | Barcode | |
|---|---|---|---|---|---|---|---|---|---|
| AM | PERPUSTAKAAN LINGKUNGAN KEDUA | PERPUSTAKAAN LINGKUNGAN KEDUA KOLEKSI AM-P. LINGKUNGAN KEDUA | TK7870.15.G56 (Browse shelf(Opens below)) | 1 | Available | 00000761494 |
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| TK7870.15.F356 3 Failure-free integrated circuit packages : systematic elimination of failures through reliability engineering, failure analysis, and material improvements / | TK7870.15.F863 3 Fundamentals of microsystems packaging / | TK7870.15.G558 3 MEMS/MOEMS packaging : concepts, designs, materials, and processes / | TK7870.15.G56 Electronic equipment packaging technology | TK7870.15.G744 2012 3 Hermeticity of electronic packages / | TK7870.15.H36 Handbook of electronic package design / | TK7870.15.L53 Multichip module design, fabrication and testing |
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