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Wire bonding in microelectronics / George G. Harmon
Publication details: New York : McGraw-Hill, 2010Edition: 3rd edDescription: xx, 426 p. : ill. ; 24 cm. + 1 computer optical disc (4 3/4 in.)ISBN:- 9780071476232 :
| Item type | Current library | Home library | Call number | Materials specified | Copy number | Status | Date due | Barcode | |
|---|---|---|---|---|---|---|---|---|---|
| AM | PERPUSTAKAAN LINGKUNGAN KEDUA | PERPUSTAKAAN LINGKUNGAN KEDUA KOLEKSI AM-P. LINGKUNGAN KEDUA | TK7836.H373 2010 3 (Browse shelf(Opens below)) | 1 | Available | 00002018605 | |||
| MEDIA | PERPUSTAKAAN LINGKUNGAN KEDUA | PERPUSTAKAAN LINGKUNGAN KEDUA MEDIA-P. LINGKUNGAN KEDUA | TK7836.H373 2010 3 (Browse shelf(Opens below)) | cd-rom | 1 | Available | 00002212293 |
Rev. ed. of : Reliability and yield problems of wire bonding in microelectronics, 1989
Book is accompanied by 1 computer optical disc, entitled'Wire bonding in microelectronics, 3rd ed.' bearing the same call number and available at Bahagian Koleksi Media
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